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Pilz Releases IO-Link Safety Master for Modular and Decentralized Automation

Pilz Releases IO-Link Safety Master for Modular and Decentralized Automation

The IO-Link safety master PDP67 is part of Pilz’s larger IO-Link safety system. The master functions as a decentralized interface to the safety control system, enabling simple and scalable automation.


News Oct 12, 2025 by Seth Price
Wenglor Introduces Contrast Sensor for Reliable Print Mark Detection

Wenglor Introduces Contrast Sensor for Reliable Print Mark Detection

The P1MW contrast sensor series is designed to detect print marks in packaging systems. The series features a compact design and reliable contrast recognition for high-volume environments limited in space.


News Oct 11, 2025 by Joshua Tidwell
Carlo Gavazzi Launches ATEX-Compliant Power Relay Series

Carlo Gavazzi Launches ATEX-Compliant Power Relay Series

The new CF/CS30 electromechanical power relays feature ATEX certification compliance, making them suitable for use in hazardous environments where flammable and combustible materials are used.


News Oct 08, 2025 by Seth Price
IMI Delivers Strong Authority in Fluid and Motion to PACK EXPO

IMI Delivers Strong Authority in Fluid and Motion to PACK EXPO

Rugged, reliable components are a cornerstone of anything that moves. IMI brought the combined expertise of leaders in fluid controls, actuation, electrical motion, and communications to PACK EXPO.


News Oct 06, 2025 by David Peterson
IDEC Releases Illuminated, Low-Voltage Emergency Stop Switches

IDEC Releases Illuminated, Low-Voltage Emergency Stop Switches

IDEC has expanded its XW and XA series of emergency stop buttons with 3 - 6 V DC illuminated models for use in battery-powered and low-voltage equipment.


News Oct 06, 2025 by Shawn Dietrich
KEB Spotlights Drive, Motor, and Controller Innovation at PACK EXPO

KEB Spotlights Drive, Motor, and Controller Innovation at PACK EXPO

KEB displayed a wide range of motors, drive units, and controllers at PACK EXPO, with key demos combining motion solutions that boost speed and flexibility for modern packaging automation.


News Oct 06, 2025 by David Peterson
HIWIN Brings Integrated Motion and Robotics to PACK EXPO

HIWIN Brings Integrated Motion and Robotics to PACK EXPO

HIWIN’s PACK EXPO booth demos included high-speed, precise, and flexible packaging applications, bringing attention to the company’s extensive lineup of motion systems, servo drives, and robots.


News Oct 06, 2025 by David Peterson
NORD Features Smart, Efficient Drives and Analytics at PACK EXPO

NORD Features Smart, Efficient Drives and Analytics at PACK EXPO

NORD Drivesystems exhibited IE5+ motors, NORDAC drives, and condition monitoring at PACK EXPO, highlighting connectivity across motion solutions as the next advancement of packaging systems.


News Oct 05, 2025 by David Peterson
Turck Presents Smart ID, Sensing, and Fieldbus Solutions at PACK EXPO

Turck Presents Smart ID, Sensing, and Fieldbus Solutions at PACK EXPO

Turck’s PACK EXPO booth highlighted RFID for traceability, level sensing for process automation, and distributed I/O technologies for IIoT-ready packaging systems.


News Oct 05, 2025 by David Peterson
Weidmuller Expands u-OS Operating System, Simplifying Data Exchange

Weidmuller Expands u-OS Operating System, Simplifying Data Exchange

Weidmuller offers machine builders a helping hand by enabling secure access to machine data using industry-approved protocols that are not brand-specific.


News Oct 04, 2025 by Shawn Dietrich
C‑Motive Presents Electrostatic Motor Innovation at PACK EXPO

C‑Motive Presents Electrostatic Motor Innovation at PACK EXPO

C‑Motive demonstrated the capabilities of electrostatic motors at PACK EXPO in Las Vegas. The technology offers high torque, low heat, low noise, and magnet-free efficiency for packaging motion.


News Oct 02, 2025 by David Peterson
Strength in Unity: Universal Robots UR+ Ecosystem at PACK EXPO

Strength in Unity: Universal Robots UR+ Ecosystem at PACK EXPO

Robots are a good thing, but robots built around a strong system of integration partners and turn-key solutions to solve nearly every packaging automation challenge? That’s a great thing.


News Oct 02, 2025 by David Peterson
FANUC Displays Food-Grade and End-of-Line Robotics at PACK EXPO

FANUC Displays Food-Grade and End-of-Line Robotics at PACK EXPO

Palletizing and food-grade applications were the central theme of FANUC’s PACK EXPO exhibit, providing tailored examples for robotic solutions across the packaging industry.


News Oct 01, 2025 by David Peterson
ABB Gives Robots “Eyes,” Enhancing Machine Sensing and Perception

ABB Gives Robots “Eyes,” Enhancing Machine Sensing and Perception

ABB Robotics’ new OmniCore EyeMotion is a fully integrated vision system that combines hardware and software, enabling OmniCore-powered robots to “see” and interact with their environment.


News Sep 30, 2025 by Seth Price
Yaskawa Motoman Pushes Robotic AI Boundaries at PACK EXPO Las Vegas

Yaskawa Motoman Pushes Robotic AI Boundaries at PACK EXPO Las Vegas

Yaskawa provided a host of concrete examples of AI in the packaging industry, from part presentation and inspection to palletizing and package sorting using a variety of industrial robot models.


News Sep 30, 2025 by David Peterson
A Look at Turck’s Safety Barriers and IO-Link Capable Level Radar Sensors

A Look at Turck’s Safety Barriers and IO-Link Capable Level Radar Sensors

Turck’s IMX18 safety barriers are designed for compact control cabinet setups, while the LRS510 level radar sensors with IO-Link are built for precise level measurements up to 10 m.


News Sep 27, 2025 by Bob Odhiambo
Wago Expands I/O System, Releases 750 Series Safety Logic Modules

Wago Expands I/O System, Releases 750 Series Safety Logic Modules

Wago adds functional safety modules to its existing I/O System 750, giving designers the power to include safe I/O without the need for a safety PLC.


News Sep 26, 2025 by Shawn Dietrich
Emerson Introduces Next-Generation PACSystems Industrial PCs

Emerson Introduces Next-Generation PACSystems Industrial PCs

The new PACSystems IPC 6010, 7010, and 8010 feature an industrial-grade 13th Generation Intel Core processor to meet the computing demands of modern AI-powered automation systems.


News Sep 25, 2025 by Seth Price
Keyence Launches Battery-Free Servo System With EtherCAT Support

Keyence Launches Battery-Free Servo System With EtherCAT Support

Keyence’s new SV3 series EtherCAT servo system features a 26-bit encoder resolution, 3.1 kHz response time, and battery-free design for high-speed, reduced-maintenance motion.


News Sep 24, 2025 by Austin Futrell
Telemecanique Sensors Introduces Ultrasonic Fork Sensor for Packaging

Telemecanique Sensors Introduces Ultrasonic Fork Sensor for Packaging

Ultrasonic waves can detect labels that optical sensors might miss. Telemecanique Sensors’ XUVU04 ultrasonic fork sensor is designed to detect various label types in compact setups and high-speed operations.


News Sep 23, 2025 by Seth Price